Achieves 10 times the thermal conductivity compared to conventional printed circuit board materials!
The heat emitted by high-brightness LEDs and power devices destabilizes their operation and accelerates the degradation of surrounding materials such as substrates and encapsulating resins. Therefore, substrate materials are required to efficiently transfer heat to the casing and heat sinks. High thermal conductivity printed circuit board materials support the heat dissipation design of substrates equipped with high-brightness LEDs and power semiconductors, with a thermal conductivity that is ten times greater than that of standard printed circuit board materials (FR-4).
------------------------------【Features】---------------------------------
■ Achieves a thermal conductivity of 3.0 W/mK with glass cloth
■ Can be made thin, thus supporting thermal management from the aspect of "reducing thermal resistance"
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